Canteliver Probe Card
MPI Cantilever Probe Card is greatly applied on gold bump and pad wafer screening for Display screen driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response into the demands of fine pitch, little pad measurement, significant velocity, significantly less cleansing, multi-DUT, significant pin depend, and ultra-reduced leakage demands. With remarkable craftsmanship, revolutionary architecture and verified methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider worldwide.
FCB Probe Card
The FCB Probe Card is the most mature technologies of buckling beam probe card. It's aimed to achieve the semiconductor ship manufacture time-to-marketplace (TTM) and cost of test (COT) demand. FCB is a tested Alternative for a range of semiconductor generation assessments from early engineering pilot-runs to high quantity production (HVM). FCB is ready for machine demanding large signal integrity probing (SI) and/or ability integrity probing (PI). Apps incorporate cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB ensures the entire world’s very best In general Value-of-ownership (COO) for many DUT programs.
EVS Probe Card
The EVS Probe Card is an enhancement around the traditional buckling beam probe card. Vital capabilities are greater present-day carrying capability (C.C.C.) and lessen balanced Call power (BCF), as well as Total MEMS-like characteristics. EVS more info can certainly meet the prerequisite of Sophisticated wafer probing. Exact alignment and excellent planarity Management would be the essential factors contributing to steady Call resistance. With its capacity and functionality, EVS Probe Card is an ideal choice for State-of-the-art probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to need for at any time finer pitch. It's made for scaled-down Al pad, and is particularly ideal for tiny pitch application with peripheral and entire array sample. With specific alignment and better planarity Manage, Osprey can get to better efficiency by multi-DUT design. The forming wire (FW) sort needle developed with MPI’s individual micro fabrication system not only delivers higher-top quality functionality and also lets quick needle substitution and shortens protecting cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle which is designed for the demand from customers of small drive probing. In addition it comes along with a chance to fulfill large C.C.C. and substantial pin counts application. The MEMS method guarantees highly consistent needle properties, as well as Exclusive framework design and style enables specific alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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